3D Glass Solutions Inc has raised an additional $4 million in an extended funding round. New investor Menlo Microsystems Inc. as well as follow-on investments from both Corning Incorporated and Sun Mountain Capital, bringing the total raised to $24 million.

The funding round comes on the heels of 3DGS securing a licensing agreement with Corning for process and know-how related to forming through glass vias (TGV) in HPFS fused silica, as well as a corresponding long term supply agreement for glass wafers.

The addition of this technology complements 3DGS’ existing portfolio and provides entry into adjacent market areas.

The initial use of the technology will be for supply of components to Menlo Microsystems for its Ideal Switch, under a long-term supply agreement between 3DGS and Menlo Microsystems.

“Corning continues to believe in the versatility and benefits of through glass vias, or TGV, technology that will support the progression of glass use in the semiconductor industry, enabling the industry to facilitate innovative solutions supporting Moore’s Law,” said David Velasquez, vice president and general manager, Corning Advanced Optics. “We are looking forward to furthering our long-term partnership with 3DGS and its novel product and process capability that will advance this unique technology.”

"We are excited to strengthen our partnership with 3DGS and it underscores the importance of our longstanding strategic relationship in driving our Ideal Switch technology into many different segments," said Russ Garcia, CEO of Menlo Micro. "As we continue to advance the most important electronic component since the transistor, the synergies between Menlo and 3DGS are growing. The development of glass processing and advanced glass packaging has become a critical element of the semiconductor supply chain, and we look forward to working together to bring exciting new products to the market in the years ahead."

www.3DGSinc.com

Image: 3DGS licenses advanced through glass via (TGV) formation process from Corning